- Foundation laid for advanced chip packaging unit in Bhubaneswar
- Project expected to generate around 2,500 jobs
- Odisha emerging as electronics and IT manufacturing hub
Bhubaneswar: The Odisha semiconductor plant Bhubaneswar marks a major milestone in India’s push towards technological self-reliance. Chief Minister Mohan Charan Majhi laid the foundation stone for an advanced chip packaging facility by 3D Glass Solutions Inc. (3DGS) at Info Valley, Bhubaneswar.
The event was attended by Union Minister Ashwini Vaishnaw along with other key dignitaries, highlighting the national importance of the project.
Advanced Chip Packaging Facility to Boost Jobs
The facility, to be developed by Heterogeneous Integration Packaging Solutions (3DGS), will introduce advanced semiconductor packaging technologies in India.
Key highlights:
- Expected to create around 2,500 jobs
- Focus on advanced chip packaging and integration
- Strengthens India’s semiconductor ecosystem
This project is seen as a major step in generating skilled employment and boosting high-tech manufacturing.
Why This Odisha Semiconductor Plant Bhubaneswar Is Important
Union Minister Ashwini Vaishnaw described the development as a “historic day” for Odisha.
He emphasized that the state is rapidly transforming into:
- An IT hub
- An electronics manufacturing hub
- A diversified industrial economy beyond metals and minerals
The project aligns with India’s broader vision of becoming self-reliant in semiconductor manufacturing.
Details of 3D Glass Solutions Facility
The 3DGS unit will focus on cutting-edge technologies such as:
- Glass interposers
- 3D heterogeneous integration modules
- Advanced chip packaging solutions
Production capacity includes:
- 69,600 glass panel substrates annually
- 50 million assembled units per year
These technologies will support sectors like artificial intelligence, high-performance computing, and photonics.
SiCSem Project: Another Major Boost
Alongside 3DGS, another key project is being set up by SiCSem Private Limited in collaboration with Clas-SiC Wafer Fab Ltd., UK.
Key features:
- India’s first commercial compound semiconductor fabrication unit
- Focus on Silicon Carbide (SiC) devices
- Annual capacity of 60,000 wafers
- Packaging capacity of 96 million units
These semiconductors will be used in:
- Defence
- Electric vehicles
- Railways
- Renewable energy
India’s Growing Semiconductor Ecosystem
The Centre has approved 10 semiconductor projects across India, with investments exceeding Rs 1.6 lakh crore.
Odisha hosting two major projects highlights its growing importance in the sector.
The initiative is expected to:
- Generate thousands of skilled jobs
- Boost domestic manufacturing
- Reduce dependency on imports
- A Step Towards Technological Self-Reliance
The Odisha semiconductor plant Bhubaneswar represents a significant leap toward building a strong and self-reliant semiconductor ecosystem in India.
With advanced technology, job creation, and global collaborations, Odisha is positioning itself as a key player in the future of electronics and innovation.
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