Odisha Semiconductor Plant Bhubaneswar: Foundation Laid for Advanced Chip Facility

KEY TAKEAWAYS:

Foundation laid for advanced chip packaging unit in Bhubaneswar
Project expected to generate around 2,500 jobs
Odisha emerging as electronics and IT manufacturing hub

Bhubaneswar: The Odisha semiconductor plant Bhubaneswar marks a major milestone in India’s push towards technological self-reliance. Chief Minister Mohan Charan Majhi laid the foundation stone for an advanced chip packaging facility by 3D Glass Solutions Inc. (3DGS) at Info Valley, Bhubaneswar.

The event was attended by Union Minister Ashwini Vaishnaw along with other key dignitaries, highlighting the national importance of the project.

Advanced Chip Packaging Facility to Boost Jobs

The facility, to be developed by Heterogeneous Integration Packaging Solutions (3DGS), will introduce advanced semiconductor packaging technologies in India.

Key highlights:

Expected to create around 2,500 jobs
Focus on advanced chip packaging and integration
Strengthens India’s semiconductor ecosystem

This project is seen as a major step in generating skilled employment and boosting high-tech manufacturing.

Why This Odisha Semiconductor Plant Bhubaneswar Is Important

Union Minister Ashwini Vaishnaw described the development as a “historic day” for Odisha.

He emphasized that the state is rapidly transforming into:

An IT hub
An electronics manufacturing hub
A diversified industrial economy beyond metals and minerals

The project aligns with India’s broader vision of becoming self-reliant in semiconductor manufacturing.

Details of 3D Glass Solutions Facility

The 3DGS unit will focus on cutting-edge technologies such as:

Glass interposers
3D heterogeneous integration modules
Advanced chip packaging solutions

Production capacity includes:

69,600 glass panel substrates annually
50 million assembled units per year

These technologies will support sectors like artificial intelligence, high-performance computing, and photonics.

SiCSem Project: Another Major Boost

Alongside 3DGS, another key project is being set up by SiCSem Private Limited in collaboration with Clas-SiC Wafer Fab Ltd., UK.

Key features:

India’s first commercial compound semiconductor fabrication unit
Focus on Silicon Carbide (SiC) devices
Annual capacity of 60,000 wafers
Packaging capacity of 96 million units

These semiconductors will be used in:

Defence
Electric vehicles
Railways
Renewable energy

India’s Growing Semiconductor Ecosystem

The Centre has approved 10 semiconductor projects across India, with investments exceeding Rs 1.6 lakh crore.

Odisha hosting two major projects highlights its growing importance in the sector.

The initiative is expected to:

Generate thousands of skilled jobs
Boost domestic manufacturing
Reduce dependency on imports
A Step Towards Technological Self-Reliance

The Odisha semiconductor plant Bhubaneswar represents a significant leap toward building a strong and self-reliant semiconductor ecosystem in India.

With advanced technology, job creation, and global collaborations, Odisha is positioning itself as a key player in the future of electronics and innovation.

Also Read | Odia Mandatory in Schools Odisha: Govt Pushes Language and Cultural Identity

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